Soldering

Board-Level Repair & Micro-Soldering for Business

Component-level rework on PCBs you didn't design. BGA reballing, IC replacement, trace and pad repair, connector replacement. Done under microscope on an ESD-safe bench.

Component-level board repair.

Board-level repair targets the actual failed components on a PCB rather than swapping the whole assembly. A blown capacitor, a failed driver IC, a cracked BGA, a torn trace, a corroded connector. These are bench-repairable faults under a microscope.

We work on logic boards, control PCBs, sensor boards, and embedded-systems hardware across consumer and commercial electronics. Anything with a circuit board and reasonably accessible components is in scope.

How a typical job goes.

You reach out through the inquiry form or call us, with an NDA in place first if you've asked for one. The device comes to the bench for diagnosis. We send a written quote with the price and turnaround, and nothing moves forward without your go-ahead.

Repair happens under microscope on the ESD bench with before-and-after photo documentation. Once functional QC is done, you pick the board up at our Orleans shop or we ship it back to you, backed by a workmanship warranty.

Capabilities

What we handle

BGA Reballing & Reflow

Removal, reballing, and reflow of ball grid array chips on GPUs, chipsets, and PMICs. Hot-air and IR preheat profile-controlled. Graphics card reballing for individual owners has its own service with the full details.

BGA Reballing & Reflow details

IC Component Replacement

Surface-mount IC swap for power management, audio codecs, display drivers, and microcontroller packages.

Trace & Pad Repair

Restoration of broken or lifted PCB traces and pads with micro-jumpers, conductive epoxy, or solder-mask repair.

Connector Replacement

Board-mounted connector swaps: charge ports, FPC connectors, board-to-board, RJ45/USB, ribbon-cable headers.

Cold-Joint & Reflow Repair

Fixing intermittent issues on aged equipment from cracked or degraded solder joints. Selective reflow without damaging neighbours.

Conformal Coating Removal & Reapplication

Coating removal for diagnosis and component access, with proper reapplication after repair on industrial and outdoor boards.

Liquid-Damage Recovery

Ultrasonic cleaning, corrosion removal, oxidation reversal, and replacement of damaged components on the affected board area.

Failure-Analysis Reports

Photo-documented root-cause reports suitable for warranty claims, insurance, or internal QA review.

Request a Quote

Tell us what you're sending.

Written quote within 1 business day. NDA available on request before any specs or photos are exchanged.

Phone: (613) 424-0444

Address: 3735 St. Joseph Blvd, Unit E, Orleans

FAQ

Frequently Asked Questions

Stereo microscope (10x to 40x), hot-air rework station with profile control, IR preheater, fine-tip soldering iron with temperature regulation, BGA rework setup, ultrasonic cleaner, and an ESD-safe workstation with mat, wrist strap, and ionizer.
Yes. Schematics or proprietary fixtures help us work faster when you can share them, but they aren't required. We diagnose from symptoms, board topology, and standard reference designs.
Yes, including multi-layer HDI boards. The complexity is factored into the written quote.
A diagnostic fee covers the bench evaluation and a written assessment. If the board comes back as a failure analysis instead of a repair, you get a written report on what we found.

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