Component-level rework on PCBs you didn't design. BGA reballing, IC replacement, trace and pad repair, connector replacement. Done under microscope, on an ESD-safe bench, following IPC-7711/7721 procedures.
Most OEMs respond to a board failure by quoting a full replacement. That makes sense for them. For you, it usually means paying 5x to 20x what the actual fault costs to fix. Board-level repair targets the one or two failed components rather than the whole assembly.
We work on logic boards, control PCBs, sensor boards, and embedded-systems hardware where the OEM swap path is either uneconomical, slow, or no longer available. Anything with a circuit board and reasonably accessible components is in scope.
We follow the procedures even where we are not yet formally certified. If your purchasing process requires a specific certification, ask us and we will tell you exactly where we stand.
Removal, reballing, and reflow of ball grid array chips on GPUs, chipsets, and PMICs. Hot-air and IR preheat profile-controlled.
Surface-mount IC swap for power management, audio codecs, display drivers, and microcontroller packages.
Restoration of broken or lifted PCB traces and pads with micro-jumpers, conductive epoxy, or solder-mask repair.
Board-mounted connector swaps: charge ports, FPC connectors, board-to-board, RJ45/USB, ribbon-cable headers.
Fixing intermittent issues on aged equipment from cracked or degraded solder joints. Selective reflow without damaging neighbours.
Coating removal for diagnosis and component access, with proper reapplication after repair on industrial and outdoor boards.
Ultrasonic cleaning, corrosion removal, oxidation reversal, and replacement of damaged components on the affected board area.
Photo-documented root-cause reports suitable for warranty claims, insurance, or internal QA review.
Written quote within 1 business day. NDA available on request before any specs or photos are exchanged.
Phone: (613) 424-0444
Address: 3735 St. Joseph Blvd, Unit E, Orleans